Strong on the globe with sustainable performance
Fuji Electric is committed to thoroughly exercising synergies between its core power semiconductor and power electronics technologies. By combining high-quality equipment employing key devices with engineering services, optimal control technologies, and IoT technologies developed through frontline operations, we will make contributions to the creation of a responsible and sustainable society in industrial and social infrastructure fields.
EconoPACK™ and PrimePACK™ are registered trademarks of Infineon Technology AG, Germany.
7th Generation X series RC-IGBT
RC-IGBT is an acronym of „Reverse Conducting Insulated Gate Bipolar Transistor“. The RC-IGBT chip combines both, IGBT and FWD, in one single chip. It has excellent heat dissipation due to alternating operation of IGBT and FWD as well as reduced number of chips. The temperature cycle height is strongly reduced, which increases the reliability of the modules equipped with RC-IGBT chips to unprecedented levels. The RC-IGBT chips enabled Fuji to strongly increase the power density in a given module size.
RC-IGBT modules are suitable for heavy duty motor drive applications, or wherever highest levels of robustness for the IGBT and especially the free-wheeling diode are needed.